NCV8184

http://onsemi.com

9

Table 1. SOIC−8 Thermal RC Network Models*

Board Type

Min−Pad

1.0 inch Pad

Min−Pad

1.0 inch Pad

(SPICE Deck Format)

Cauer Network

Foster Network

Min

1.0 inch

Units

Tau

Tau

Units

C_C1

Junction

Gnd

7.06879E−7

7.06879E−7

W−s/C

2.99E−7

2.99E−7

sec

C_C2

node1

Gnd

3.34499E−6

3.34499E−6

W−s/C

4.40E−6

4.40E−6

sec

C_C3

node2

Gnd

1.00350E−5

1.00350E−5

W−s/C

4.48E−5

4.48E−5

sec

C_C4

node3

Gnd

3.68358E−5

3.68358E−5

W−s/C

2.46E−4

2.46E−4

sec

C_C5

node4

Gnd

4.29554E−4

4.29554E−4

W−s/C

4.72E−3

4.72E−3

sec

C_C6

node5

Gnd

7.20791E−3

7.20791E−3

W−s/C

7.18E−2

7.25E−2

sec

C_C7

node6

Gnd

3.52182E−2

3.76156E−2

W−s/C

1.61E+0

1.31E+0

sec

C_C8

node7

Gnd

7.16622E−1

1.33747E+0

W−s/C

2.08E+1

1.62E+1

sec

C_C9

node8

Gnd

6.57830E+0

3.97588E+0

W−s/C

1.33E+2

1.08E+2

sec

Min

1.0 inch

R’s

R’s

R_R1

Junction

node1

5.17805E−1

5.1780E−1

°C/W

0.34137

0.34137

°C/W

R_R2

node1

node2

1.55341E+0

1.5534E+0

°C/W

0.83581

0.83581

°C/W

R_R3

node2

node3

4.66024E+0

4.6602E+0

°C/W

2.36526

2.36526

°C/W

R_R4

node3

node4

4.98386E+0

4.9838E+0

°C/W

6.76959

6.76960

°C/W

R_R5

node4

node5

1.04570E+1

1.0457E+1

°C/W

10.39190

10.39200

°C/W

R_R6

node5

node6

1.14509E+1

1.1450E+1

°C/W

8.68648

8.81855

°C/W

R_R7

node6

node7

3.94880E+1

2.9500E+1

°C/W

38.62760

31.37390

°C/W

R_R8

node7

node8

3.10554E+1

1.6877E+1

°C/W

27.65780

8.93175

°C/W

R_R9

node8

node9

1.77562E+1

1.8812E+1

°C/W

26.24690

28.98470

°C/W

Table 2. DPAK 5−Lead Thermal RC Network Models*

Drain Copper Area (1 oz thick)

(SPICE Deck Format)

Cauer Network

Foster Network

Units

Tau

Tau

Units

C_C1

Junction

Gnd

1.51E−06

1.51E−06

W−s/C

1.00E−06

1.00E−06

sec

C_C2

node1

Gnd

6.00E−06

5.91E−06

W−s/C

1.00E−05

1.00E−05

sec

C_C3

node2

Gnd

1.90E−05

1.81E−05

W−s/C

1.00E−04

1.00E−04

sec

C_C4

node3

Gnd

1.05E−04

9.59E−05

W−s/C

7.00E−04

6.00E−04

sec

C_C5

node4

Gnd

2.98E−03

3.21E−03

W−s/C

1.03E−02

1.03E−02

sec

C_C6

node5

Gnd

2.37E−02

7.87E−02

W−s/C

1.71E−01

1.71E−01

sec

C_C7

node6

Gnd

4.95E−02

7.88E−02

W−s/C

1.17E+00

1.17E+00

sec

C_C8

node7

Gnd

2.32E−01

1.03E+00

W−s/C

7.63E+00

7.63E+00

sec

C_C9

node8

Gnd

6.95E−01

1.58E+00

W−s/C

3.93E+01

3.93E+01

sec

C_C10

node9

Gnd

6.91E+00

1.16E+01

W−s/C

1.42E+02

1.42E+02

sec

R’s

R’s

R_R1

Junction

node1

0.845

0.850

°C/W

0.507

0.507

°C/W

R_R2

node1

node2

1.886

1.933

°C/W

1.096

1.096

°C/W

R_R3

node2

node3

4.758

5.070

°C/W

3.467

3.467

°C/W

R_R4

node3

node4

5.336

4.862

°C/W

7.168

7.168

°C/W

R_R5

node4

node5

3.735

3.201

°C/W

3.394

3.394

°C/W

R_R6

node5

node6

10.537

5.293

°C/W

4.000

0.720

°C/W

R_R7

node6

node7

19.583

6.828

°C/W

15.000

8.912

°C/W

R_R8

node7

node8

38.068

13.172

°C/W

20.000

3.636

°C/W

R_R9

node8

node9

43.000

16.466

°C/W

50.000

15.161

°C/W

R_R10

node9

gnd

16.884

8.868

°C/W

40.000

22.480

°C/W

*Bold face items in the tables above represent the package without the external thermal system.