11

AT93C56A/66A

3378K–SEEPR–12/06

Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.

2. “U” designates Green package + RoHS compliant.

3. “H” designates Green package + RoHS compliant, with NiPdAu Lead Finish.

4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please

contact Serial EEPROM Marketing.

Ordering Code

Package

Operation Range

8P3

8P3

8S1

8S1

8S2

8S2

8A2

8A2

8U3-1

8Y1

8Y6

Lead-free/Halogen-free/

Industrial Temperature

(

−40°C to 85°C)

Die Sale

Industrial Temperature

(

−40°C to 85°C)

Package Type

8P3

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S1

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8S2

8-lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)

8A2

8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)

8U3-1

8-ball, die Ball Grid Array Package (dBGA2)

8Y1

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

8Y6

8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead package (DFN), (MLP 2x3 mm)

Options

−2.7

Low-voltage (2.7V to 5.5V)

−1.8

Low-voltage (1.8V to 5.5V)