NCV4269D1R2 datasheet(3/16 Pages) ONSEMI

Part #	NCV4269D1R2

Description	5.0 V Micropower 150 mA LDO Linear Regulator with DELAY, Adjustable RESET, and Sense Output

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NCV4269

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MAXIMUM RATINGS (TJ = −40°C to 150°C)

Parameter

Symbol

Min

Max

Unit

Input to Regulator

VI

II

−40

Internally Limited

45

Internally Limited

V

Input Transient to Regulator

VI

−

60

V

Sense Input

VSI

ISI

−40

−1

45

1

V

mA

Reset Threshold Adjust

VRADJ

IRADJ

−0.3

−10

7

10

V

mA

Reset Delay

VD

ID

−0.3

Internally Limited

7

Internally Limited

V

Ground

Iq

50

−

mA

Reset Output

VRO

IRO

−0.3

Internally Limited

7

Internally Limited

V

Sense Output

VSO

ISO

−0.3

Internally Limited

7

Internally Limited

V

Regulated Output

VQ

IQ

−0.5

−10

7.0

−

V

mA

Junction Temperature

Storage Temperature

TJ

TSTG

−

−50

150

°C

Input Voltage Operating Range

Junction Temperature Operating Range

VI

TJ

−

−40

45

150

V

°C

Lead Temperature Soldering and MSL

Parameter

Symbol

Value

MSL, 20−Lead LS Temperature 265

°C Peak (Note 3)

MSL

3

MSL, 20−Lead, LS Temperature 240

°C Peak (Note 4)

MSL

1

MSL, 8−Lead, 14−Lead, LS Temperature 265

°C Peak (Note 3)

MSL

1

MSL, 8−Lead EP, LS Temperature 260

°C

MSL

2

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series incorporates ESD protection and exceeds the following ratings:

Human Body Model (HBM)

≤ 2.0 kV per JEDEC standard: JESD22–A114.

Machine Model (MM)

≤ 200 V per JEDEC standard: JESD22–A115.

2. Latchup Current Maximum Rating:

≤ 150 mA per JEDEC standard: JESD78.

3. +5

°C/−0°C, 40 Sec Max−at−Peak, 60 − 150 Sec above 217°C.

4. +5

°C/−0°C, 30 Sec Max−at−Peak, 60 − 150 Sec above 183°C.

THERMAL CHARACTERISTICS

Characteristic

Test Conditions (Typical Values)

Unit

SO−8 Package (Note 5)

Junction−to−Pin 4 (

Y − JL4, YL4)

53.8

°C/W

Junction−to−Ambient Thermal Resistance (RqJA, qJA)

170.9

°C/W

SO−8 EP Package (Note 5)

Junction−to−Pin 8 (

Y − JL8, YL8)

23.7

°C/W

Junction−to−Ambient Thermal Resistance (RqJA, qJA)

71.4

°C/W

Junction−to−Pad (

Y − JPad)

7.7

°C/W

SO−14 Package (Note 5)

Junction−to−Pin 4 (

Y − JL4, YL4)

18.4

°C/W

Junction−to−Ambient Thermal Resistance (RqJA, qJA)

111.6

°C/W

SO−20 Package (Note 5)

Junction−to−Pin 4 (

Y − JL4, YL4)

21.8

°C/W

Junction−to−Ambient Thermal Resistance (RqJA, qJA)

95.3

°C/W

5. 2 oz copper, 50 mm2 copper area, 1.5 mm thick FR4

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NCV4269D1R2 Datasheet(PDF) 3 Page - ON Semiconductor

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