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NCP5208DR2G Datasheet(PDF) 1 Page - ON Semiconductor

Part # NCP5208DR2G
Description  DDR?묲/II Termination Regulator
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2006
May, 2006 − Rev. 5
1
Publication Order Number:
NCP5208/D
NCP5208
DDR−I/II Termination
Regulator
The NCP5208 is a linear regulator specifically designed for the
active termination of DDR−I/II SDRAM. The device can be operated
from a single supply voltage as low as 1.7 V. For DDR−I
applications, the device is capable of sourcing and sinking current up
to 1.5 A with the output voltage regulated to within
"3% or better. A
separate voltage feedback pin ensures superior load regulation
against load and line changes.
Protective features include soft−start, source/sink current limits
and thermal shutdown. Open−drain VTT OK output (POK) is added
for system monitoring. The shutdown pin can tri−state the regulator
output for Suspend To RAM (STR) state. This device is available in a
SOIC−8 package.
Features
Supports Both DDR−I and DDR−II SDRAM Requirements
Single Supply Voltage Operation as Low as 1.7 V
Integrated Power MOSFETs
Few External Components Needed
Source and Sink Current Up to 1.5 A
Load Regulation Within "3%
Both Source and Sink Current Limits
Open−Drain VTT OK (POK) Pin
Shutdown Pin
Thermal Shutdown
Housed in SOIC−8 Package
Pb−Free Package is Available
Typical Applications
DDR Termination Voltage
Active Bus Termination (SSTL−2, SSTL−3)
Figure 1. Typical Application Circuit
NCP5208
SD
POK
AVIN
VTT
VFB
VTT
1.25 V,
1.5 A
COUT
2.5 V
VDDQ
VDDQ
CIN
AVIN
PVIN
2.5 V
GND
SOIC−8
D SUFFIX
CASE 751
PIN CONNECTIONS
Device
Package
Shipping
ORDERING INFORMATION
NCP5208DR2
SOIC−8
2500/Tape & Reel
http://onsemi.com
MARKING DIAGRAM
18
5
3
4
(Top View)
POK
VFB
VTT
7
6
2
PVIN
GND
SD
VDDQ
AVIN
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W = Work Week
G
= Pb−Free Package
NCP5208DR2G
SOIC−8
(Pb−Free)
2500/Tape & Reel
1
N5208
ALYW
G
1
8


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