11

AT93C46/56/66

0172Z–SEEPR–9/05

Notes:

1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the Table 3 on page 3 and Table 4 on

page 4.

2. Available in waffle pack and wafer form, order as SL719 for wafer form. Bumped die available upon request.

Ordering Code

Package

Operation Range

AT93C46-10PI-2.7

AT93C46-10SI-2.7

AT93C46R-10SI-2.7

AT93C46W-10SI-2.7

AT93C46-10TI-2.7

8P3

8S1

8S1

8S2

8A2

Industrial

(

−40°C to 85°C)

AT93C46-10PI-1.8

AT93C46-10SI-1.8

AT93C46R-10SI-1.8

AT93C46W-10SI-1.8

AT93C46-10TI-1.8

8P3

8S1

8S1

8S2

8A2

Industrial

(

−40°C to 85°C)

AT93C46-10PU-2.7

AT93C46-10PU-1.8

AT93C46-10SU-2.7

AT93C46-10SU-1.8

AT93C46W-10SU-2.7

AT93C46W-10SU-1.8

AT93C46-10TU-2.7

AT93C46-10TU-1.8

AT93C46Y1-10YU-2.7

AT93C46Y1-10YU-1.8

AT93C46Y5-10YU-2.7

AT93C46Y5-10YU-1.8

AT93C46U3-10UU-2.7

AT93C46U3-10UU-1.8

8P3

8P3

8S1

8S1

8S2

8S2

8A2

8A2

8Y1

8Y1

8Y5

8Y5

8U3-1

8U3-1

Lead-free/Halogen-free/

Industrial Temperature

(

−40°C to 85°C)

AT93C46-W2.7-11

(2)

Die Sale

Die Sale

Industrial

(

−40°C to 85°C)

Package Type

8P3

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S1

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8S2

8-lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)

8A2

8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)

8U3-1

8-ball, Die Ball Grid Array Package (dBGA2)

8Y1

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

8Y5

8-lead, 2.00 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

Options

−2.7

Low Voltage (2.7V to 5.5V)

−1.8

Low Voltage (1.8V to 5.5V)

R

Rotated Pinout