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BYV160 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BYV160 Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 8 page 2000 Feb 01 3 Philips Semiconductors Product specification Ultra fast low-loss rectifier BYV160 THERMAL CHARACTERISTICS Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.8. For more information please refer to the ‘General Part of associated Handbook’. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point lead length = 10 mm 46 K/W Rth j-a thermal resistance from junction to ambient note 1 100 K/W |
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