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WM8594 Datasheet(PDF) 6 Page - Wolfson Microelectronics plc |
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WM8594 Datasheet(HTML) 6 Page - Wolfson Microelectronics plc |
6 / 78 page WM8594 Product Preview w PP Rev 1.0 January 2007 6 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical Characteristics at the test conditions specified. ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this device. Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage conditions prior to surface mount assembly. These levels are: MSL1 = unlimited floor life at <30 °C / 85% Relative Humidity. Not normally stored in moisture barrier bag. MSL2 = out of bag storage for 1 year at <30 °C / 60% Relative Humidity. Supplied in moisture barrier bag. MSL3 = out of bag storage for 168 hours at <30 °C / 60% Relative Humidity. Supplied in moisture barrier bag. The Moisture Sensitivity Level for each package type is specified in Ordering Information. CONDITION MIN MAX Digital supply voltage, DVDD -0.3V +4.5V Analogue supply voltage, AVDD1 -0.3V +7V Analogue supply voltage, AVDD2 -0.3V +15V Voltage range digital inputs DGND -0.3V DVDD + 0.3V Voltage range analogue inputs TBD AVDD1 + 0.2V Master Clock Frequency 38.462MHz Ambient temperature (supplies applied) -55 °C +125 °C Storage temperature -65 °C +150 °C Pb free package body temperature (reflow 10 seconds) +260 °C Package body temperature (soldering 2 minutes) +183 °C Note: 1. Analogue and digital grounds must always be within 0.3V of each other. THERMAL PERFORMANCE PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Thermal resistance – junction to ambient RθJA 51.7 See note 1 °C/W Notes: 1. Figure given for package mounted on 4-layer FR4 according to JESD51-7. (No forced air flow is assumed). 2. Thermal performance figures are estimated. |
Similar Part No. - WM8594_07 |
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Similar Description - WM8594_07 |
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