NUF6401MN

http://onsemi.com

4

PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

5. EXPOSED PADS CONNECTED TO DIE FLAG.

USED AS TEST CONTACTS.

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.18

0.30

D

3.00 BSC

D2

2.10

2.30

E

1.35 BSC

E2

0.20

0.40

e

0.50 BSC

K

0.20

−−−

L

0.20

0.40

0.15 C

D

E

B

A

2 X

2 X

12 X

A

A1

(A3)

0.15 C

PIN ONE

REFERENCE

0.08 C

0.10 C

C

SEATING

PLANE

D2

E2

BOTTOM VIEW

b

e

12 X

0.10

B

0.05

A

C

C

L

12 X

K

12 X

SIDE VIEW

TOP VIEW

NOTE 3

16

7

12

2 X

NOTE 5

EXPOSED Cu

(A3)

0.2 X 0.25 MM

EXPOSED PAD

2.352

0.093

mm

inches

SCALE 16:1

0.265

0.01

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.479

0.019

0.351

0.014

DFN12 3.0*1.35*0.85

CASE 506AD−01

ISSUE F

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NUF6401MN/D

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