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NUF6105FCT1 Datasheet(PDF) 1 Page - ON Semiconductor

Part # NUF6105FCT1
Description  6 Channel EMI Pi-Filter Array with ESD Protection
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NUF6105FCT1 Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 3
1
Publication Order Number:
NUF6105FC/D
NUF6105FC
6 Channel EMI Pi−Filter
Array with ESD Protection
This device is a 6 channel EMI filter array for data lines. Greater
than −35 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers ESD protection − clamping transients from
static discharges to protect delicate data line circuitry.
Features
EMI Filtering and ESD Protection for Data Lines
Integration of 30 Discretes Offers Cost and Space Savings
Exceeds IEC61000−4−2 (Level 4) Specifications
Low Profile Flip−Chip Packaging
MSL 1
Pb−Free Package is Available
Typical Applications
EMI Filtering and ESD Protection for Data Lines
Cell Phones
Handheld Portables
Notebook Computers
MP3 Players
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
ESD Discharge IEC61000−4−2,
− Air Discharge
− Contact Discharge
Human Body Model
VPP
30
30
16
kV
DC Power per Resistor
PR
100
mW
DC Power per Package
PT
600
mW
Junction Temperature
TJ
150
°C
Operating Temperature Range
Top
−40 to +85
°C
Storage Temperature Range
Tstg
−55 to +150
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
Device
Package
Shipping
ORDERING INFORMATION
NUF6105FCT1
Flip−Chip
3000/Tape & Reel
CIRCUIT DESCRIPTION
http://onsemi.com
R1
A1
C1
D1
C1
C2
D2
R2
A2
C2
D3
C3
C4
D4
B1
R3
A3
C3
D5
C5
C6
D6
R4
A4
C4
D7
C7
C8
D8
B2
R5
A5
C5
D9
C9
C10
D10
R6
A6
C6
D11
C11 C12
D12
B3
FLIP−CHIP
CASE 499D
PLASTIC
A1
NUF6105AYWW
G
G
MARKING DIAGRAM
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
NUF6105FCT1G
Flip−Chip
(Pb−Free)
3000/Tape & Reel


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