© Semiconductor Components Industries, LLC, 2006

March, 2006 − Rev. 2

1

Publication Order Number:

NTTD1P02R2/D

NTTD1P02R2

Power MOSFET

−1.45 Amps, −20 Volts

P−Channel Enhancement Mode

Dual Micro8t Package

Features

Applications

i.e.: Computers, Printers, PCMCIA Cards, Cellular and Cordless

Telephones

Rating

Symbol

Value

Unit

Drain−to−Source Voltage

−20

V

Gate−to−Source Voltage − Continuous

"8.0

V

Thermal Resistance −

Junction−to−Ambient (Note 1)

Pulsed Drain Current (Note 3)

250

0.50

−1.45

−1.15

−10

°C/W

W

A

A

A

Thermal Resistance −

Junction−to−Ambient (Note 2)

Pulsed Drain Current (Note 3)

125

1.0

−2.04

−1.64

−16

°C/W

W

A

A

A

Operating and Storage

Temperature Range

−55 to

+150

°C

Single Pulse Drain−to−Source Avalanche

EAS

35

mJ

Maximum Lead Temperature for Soldering

Purposes for 10 seconds

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Minimum FR−4 or G−10 PCB, Steady State.

2. Mounted onto a 2” square FR−4 Board

(1 in sq, 2 oz Cu 0.06″ thick single sided), Steady State.

3. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%.

Device

Package

ORDERING INFORMATION

NTTD1P02R2

Micro8

4000/Tape & Reel

Dual P−Channel

D

S

G

−1.45 AMPERES

−20 VOLTS

http://onsemi.com

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

WW

BCG

G

1

8

S1 G1 S2 G2

D1 D1 D2 D2

MARKING DIAGRAM &

PIN ASSIGNMENT

Micro8

CASE 846A

STYLE 2

1

8

BC

= Specific Device Code

WW

= Work Week

G

= Pb−Free Package

(Note: Microdot may be in either location)

NTTD1P02R2G

Micro8

(Pb−Free)

4000/Tape & Reel