NTLTD7900ZR2

http://onsemi.com

7

PACKAGE DIMENSIONS

Micro8 LEADLESS

CASE 846C−01

ISSUE C

A

B

0.15 T

0.15 T

2X

2X

INDEX AREA

8

7

6

5

1

2

3

4

TOP VIEW

P

F

E

H

DETAIL Z

L

8X

D

W

0.05 T

NOTE 4

L1

DETAIL Z

J

T

K

0.10 T

0.08 T

8X

C

AA

AA

SEATING

PLANE

SIDE VIEW

VIEW AA−AA

NOTES:

1. DIMENSIONS AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETER.

3. THE TERMINAL #1 IDENTIFIER AND TERMINAL

NUMBERING CONVENTION SHALL CONFORM TO

JESD 95−1 SPP−012. DETAILS OF TERMINAL #1

IDENTIFIER ARE OPTIONAL, BUT MUST BE

LOCATED WITHIN THE ZONE INDICATED. THE

TERMINAL #1 IDENTIFIER MAY BE EITHER A

MOLD OR MARKED FEATURE.

4. DIMENSION D APPLIES TO METALLIZED

TERMINAL AND IS MEASURED BETWEEN

0.25 MM AND 0.30 MM FROM TERMINAL TIP.

DIMENSION L1 IS THE TERMINAL PULL BACK

FROM PACKAGE EDGE, UP TO 0.1 MM IS

ACCEPTABLE. L1 IS OPTIONAL.

5. DEPOPULATION IS POSSIBLE IN A

SYMMETRICAL FASHION.

6. OPTIONAL SIDE VIEW CAN SHOW LEADS 5 AND

8 REMOVED.

W

Y

DIM

MIN

MAX

MILLIMETERS

A

3.30 BSC

B

3.30 BSC

C

0.85

0.95

D

0.25

0.35

E

1.30

1.50

F

2.55

2.75

G

0.65 BSC

H

0.95

1.15

J

0.25 BSC

K

0.00

0.05

L

0.35

0.45

L1

0.00

0.10

P

1.28

1.38

U

W

0.10

Y

T

NOTE 4

8

7

6

5

NOTE 6

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

2.75

1.50

0.33

8X

3.60

1.23

0.65 PITCH

0.58

8X

0.40

DIMENSIONS: MILLIMETERS

0.17 TYP