NB6L72M

http://onsemi.com

10

PACKAGE DIMENSIONS

16 PIN QFN

MN SUFFIX

CASE 485G−01

ISSUE C

16X

SEATING

PLANE

L

D

E

0.15 C

A

A1

e

D2

E2

b

1

4

58

12

9

16

13

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

MINIMUM SPACING BETWEEN LEAD TIP

AND FLAG

B

A

0.15 C

TOP VIEW

SIDE VIEW

BOTTOM VIEW

PIN 1

LOCATION

0.10 C

0.08 C

(A3)

C

16 X

e

16X

NOTE 5

0.10 C

0.05 C

A B

NOTE 3

K

16X

DIM MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.18

0.30

D

3.00 BSC

D2

1.65

1.85

E

3.00 BSC

E2

1.65

1.85

e

0.50 BSC

K

L

0.30

0.50

EXPOSED PAD

0.18 TYP

mm

inches

SCALE 10:1

0.50

0.02

0.575

0.022

1.50

0.059

3.25

0.128

0.30

0.012

3.25

0.128

0.30

0.012

EXPOSED PAD

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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NB6L72M/D

ECLinPS MAX is a trademark of Semiconductor Components Industries, LLC (SCILLC).

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