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MR2535L Datasheet(PDF) 1 Page - ON Semiconductor

Part # MR2535L
Description  Overvoltage Transient Suppressors
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MR2535L Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 7
1
Publication Order Number:
MR2535L/D
MR2535L
Overvoltage
Transient Suppressors
Medium Current
Designed for applications requiring a low voltage rectifier with
reverse avalanche characteristics for use as reverse power transient
suppressors. Developed to suppress transients in the automotive
system, these devices operate in the forward mode as standard
rectifiers or reverse mode as power avalanche rectifier and will protect
electronic equipment from overvoltage conditions.
Features
Avalanche Voltage 24 to 32 V
High Power Capability
Economical
Increased Capacity by Parallel Operation
Pb−Free Packages are Available*
Mechanical Characteristics:
Case: Epoxy, Molded
Weight: 2.5 Grams (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Maximum Lead Temperature for Soldering Purposes:
350
°C 3/8″ from Case for 10 Seconds at 5 lbs. Tension
Polarity: Indicated by Diode Symbol or Cathode Band
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
DC Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
20
V
Repetitive Peak Reverse Surge Current
(Time Constant = 10 ms, Duty Cycle
≤ 1%,
TC = 25°C)
IRSM
62
A
Average Rectified Forward Current
(Single Phase, Resistive Load, 60 Hz,
TC = 125°C) (Figure 4)
IO
6.0
A
Non−Repetitive Peak Surge Current Surge
Supplied at Rated Load Conditions
Halfwave, Single Phase
IFSM
600
A
Operating and Storage Junction
Temperature Range
TJ, Tstg
−65 to +175
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device
Package
Shipping
ORDERING INFORMATION
MICRODE AXIAL
CASE 194
STYLE 1
MR2535L
Microde Axial
1000 Units/Box
MR2535LRL
Microde Axial
800/Tape & Reel
http://onsemi.com
MR2535LG
Microde Axial
(Pb−Free)
1000 Units/Box
MR2535LRLG
Microde Axial
(Pb−Free)
800/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MR2535LAYYWW
G
G
A
= Assembly Location
YY
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
MARKING DIAGRAM


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