MMSD103T1

http://onsemi.com

3

PACKAGE DIMENSIONS

SOD−123

CASE 425−04

ISSUE E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

E

b

D

A

L

C

1

2

A1

DIM

MIN

NOM

MAX

MILLIMETERS

INCHES

A

0.94

1.17

1.35

0.037

A1

0.00

0.05

0.10

0.000

b

0.51

0.61

0.71

0.020

c

1.60

0.15

0.055

D

1.40

1.80

E

2.54

2.69

2.84

0.100

−−−

3.68

0.140

L

0.25

3.86

0.010

0.046

0.002

0.024

0.063

0.106

0.145

0.053

0.004

0.028

0.071

0.112

0.152

MIN

NOM

MAX

3.56

−−−

−−−

−−−

0.006

−−−

−−−

−−−

−−−

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

1.22

0.048

0.91

0.036

2.36

0.093

4.19

0.165

mm

inches

SCALE 10:1

STYLE 1:

PIN 1. CATHODE

2. ANODE

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