NUP2105L

http://onsemi.com

7

PACKAGE DIMENSIONS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

SOT−23 (TO−236)

CASE 318−08

ISSUE AL

STYLE 27:

PIN 1. CATHODE

2. CATHODE

3. CATHODE

b

C

L

D

A

E

A1

e

3

1

2

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

0.89

1.00

1.11

0.035

INCHES

A1

0.01

0.06

0.10

0.001

b

0.37

0.44

0.50

0.015

c

0.09

0.13

0.18

0.003

D

2.80

2.90

3.04

0.110

E

1.20

1.30

1.40

0.047

e

1.78

1.90

2.04

0.070

L

0.35

0.54

0.69

0.014

2.10

2.40

2.64

0.083

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

4. 318−01 THRU −07 AND −09 OBSOLETE, NEW

STANDARD 318−08.

0.040

0.044

0.002

0.004

0.018

0.020

0.005

0.007

0.114

0.120

0.051

0.055

0.075

0.081

0.021

0.029

0.094

0.104

NOM

MAX

mm

inches

SCALE 10:1

0.8

0.031

0.9

0.035

0.95

0.037

0.95

0.037

2.0

0.079