www.ti.com

RECOMMENDED PCB LAYOUT

M0022-04

0.25TYP

Notes:9ViaHoles,Each0.38mm.

SolderMask.NoSolderMaskUnderChip,OnLeadPadsorOnGroundConnections.

DIMENSIONSinmm

DIA 0.38TYP

0.50TYP

0.60TYP

0.20TYP

2.80

2.80

2.00

2.00

PIN1

1.00TYP

1.00TYP

TRF1115

SLWS174B – APRIL 2005 – REVISED SEPTEMBER 2006

A.

Four layer Board, Starting material: two: 10 mil core FR4 with 1 oz copper, both sides, pressed with 8 mil thick

prepreg. Via plating ½ oz copper plate, final plate White immersion tin. Final thickness: 0.033” to 0.037” thick.

6

Submit Documentation Feedback