TLV2217

LOW DROPOUT FIXEDVOLTAGE REGULATORS

SLVS067L − MARCH 1992 − REVISED APRIL 2005

1

POST OFFICE BOX 655303

500 mA (3.3-V Option)

and Temperature

OUTPUT

GND

INPUT

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

GND

INPUT

GND

OUTPUT

PW (TSSOP) PACKAGE

(TOP VIEW)

HEAT

SINK

HEAT

SINK

HEAT

SINK

HEAT

SINK

KC (TO-220) PACKAGE

(TOP VIEW)

HEAT SINK − These terminals have an internal resistive connection

to ground and should be grounded or electrically isolated.

OUTPUT

GND

INPUT

GND

KTP (PowerFLEX

E/TO-252*) PACKAGE

(TOP VIEW)

GND

GND

OUTPUT

KCS (TO-220) PACKAGE

(TOP VIEW)

INPUT

*Complies with JEDEC TO-252, variation AC

description/ordering information

ORDERING INFORMATION

TJ

VO

(NOM)

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

1.8 V

PowerFLEX

/TO-252* (KTP) Reel of 3000

TLV2217-18KTPR

2217−18

1.8 V

TO-220 (KCS)

Tube of 50

TLV2217-18KCS

TLV2217−18

TO-220 (KC)

Tube of 50

TLV2217-25KC

TLV2217−25

2.5 V

PowerFLEX

/TO-252* (KTP) Reel of 3000

TLV2217-25KTPR

2217−25

0

°C to 125°C

2.5 V

TSSOP (PW)

Tube of 70

TLV2217-25PW

2217−25

0 C to 125 C

TSSOP (PW)

Reel of 2000

TLV2217-25PWR

2217−25

PowerFLEX

/TO-252* (KTP) Reel of 3000

TLV2217-33KTPR

2217−33

3.3 V

TO-220 (KC)

Tube of 50

TLV2217-33KC

TLV2217−33

3.3 V

TSSOP (PW)

Reel of 2000

TLV2217-33PWR

2217−33

*Complies to TO-252, variation AC.

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright

 2005, Texas Instruments Incorporated

PowerFLEX is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.