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MC100ELT23_06 Datasheet(PDF) 2 Page - ON Semiconductor

Part No. MC100ELT23_06
Description  5 V Dual Differential PECL to TTL Translator
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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MC100ELT23
http://onsemi.com
2
Figure 1. 8−Lead Pinout (Top View) and Logic
Diagram
1
2
3
45
6
7
8
Q0
GND
VCC
D0
Q1
D1
D1
D0
PECL
TTL
Table 1. PIN DESCRIPTION
Pin
Function
Qn
TTL Outputs
Dn, Dn
PECL Differential Inputs
VCC
Positive Supply
GND
Ground
EP
Exposed pad must be connected to a
sufficient thermal conduit. Electrically
connect to the most negative supply or
leave floating open.
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
50 kW
Internal Input Pullup Resistor
N/A
ESD Protection
Human Body Model
Machine Model
> 2 kV
> 400 V
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Pb Pkg
Pb−Free Pkg
SOIC−8
TSSOP−8
DFN8
Level 1
Level 1
Level 1
Level 1
Level 3
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
91 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
Power Supply
GND = 0 V
7
V
VI
Input Voltage
GND = 0 V
VI  VCC
0 to 6
V
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.




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