MC74VHC1G50

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8

PACKAGE DIMENSIONS

SOT23--5/TSOP--5/SC59--5

DT SUFFIX

5--LEAD PACKAGE

CASE 483--01

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

4. A AND B DIMENSIONS DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

2.90

3.10 0.1142 0.1220

B

1.30

1.70 0.0512 0.0669

C

0.90

1.10 0.0354 0.0433

D

0.25

0.50 0.0098 0.0197

G

0.85

1.05 0.0335 0.0413

H

0.013

0.100 0.0005 0.0040

J

0.10

0.26 0.0040 0.0102

K

0.20

0.60 0.0079 0.0236

L

1.25

1.55 0.0493 0.0610

M

010

0

10

S

2.50

3.00 0.0985 0.1181

0.05 (0.002)

12

3

54

S

A

G

L

B

D

H

C

K

M

J

__

_

_

Figure 12.

THIN SOT23--5/TSOP--5/SC59--5

*For additional information on our Pb--Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.7

0.028

1.0

0.039

0.95

0.037

2.4

0.094

1.9

0.074

SCALE 10:1

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