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MC74HC4046ADG Datasheet(PDF) 2 Page - ON Semiconductor

Part # MC74HC4046ADG
Description  Phase?묹ocked Loop
Download  18 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC74HC4046ADG Datasheet(HTML) 2 Page - ON Semiconductor

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MC74HC4046A
http://onsemi.com
2
Pin No.
Symbol
Name and Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PCPOUT
PC1OUT
COMPIN
VCOOUT
INH
C1A
C1B
GND
VCOIN
DEMOUT
R1
R2
PC2OUT
SIGIN
PC3OUT
VCC
Phase Comparator Pulse Output
Phase Comparator 1 Output
Comparator Input
VCO Output
Inhibit Input
Capacitor C1 Connection A
Capacitor C1 Connection B
Ground (0 V) VSS
VCO Input
Demodulator Output
Resistor R1 Connection
Resistor R2 Connection
Phase Comparator 2 Output
Signal Input
Phase Comparator 3 Output
Positive Supply Voltage
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
V
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air
Plastic DIP†
SOIC Package†
750
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP and SOIC Package†
260
_C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings
applied to the device are individual stress limit values (not normal operating conditions) and are not
valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
†Derating — Plastic DIP: – 10 mW/
_C from 65_ to 125_C
SOIC Package: – 7 mW/
_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
3.0
6.0
V
VCC
DC Supply Voltage (Referenced to GND) NON−VCO
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
– 55
+ 125
_C
tr, tf
Input Rise and Fall Time
VCC = 2.0 V
(Pin 5)
VCC = 4.5 V
VCC = 6.0 V
0
0
0
1000
500
400
ns
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND
v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
Figure 1. Pin Assignment
13
14
15
16
9
10
11
12
5
4
3
2
1
8
7
6
R2
PC2out
SIGin
PC3out
VCC
VCOin
DEMout
R1
VCOout
COMPin
PC1out
PCPout
GND
C1B
C1A
INH


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