MC10H640, MC100H640

http://onsemi.com

4

Symbol

Characteristic

Condition

0°C

25°C

85°C

Unit

Min

Max

Min

Max

Min

Max

Propagation Delay ECL

D to Output

Q0 − Q3

CL = 25 pF

4.0

6.0

4.0

6.0

4.2

6.2

ns

Propagation Delay TTL

D to Output

CL = 25 pF

4.0

6.0

4.0

6.0

4.3

6.3

ns

tskwd*

Within−Device Skew

CL = 25 pF

0.5

0.5

0.5

ns

Propagation Delay ECL

D to Output

Q0, Q1

CL = 25 pF

4.0

6.0

4.0

6.0

4.2

6.2

ns

Propagation Delay TTL

D to Output

CL = 25 pF

4.0

6.0

4.0

6.0

4.3

6.3

ns

Propagation Delay ECL

D to Output

Q4, Q5

CL = 25 pF

4.0

6.0

4.0

6.0

4.2

6.2

ns

Propagation Delay TTL

D to Output

CL = 25 pF

4.0

6.0

4.0

6.0

4.3

6.3

ns

Propagation Delay

R to Output

All Outputs

CL = 25 pF

4.3

6.3

4.3

6.3

5.0

7.0

ns

Output Rise/Fall Time

0.8 V to 2.0 V

All Outputs

CL = 25 pF

2.5

2.5

2.5

2.5

2.5

2.5

ns

Maximum Input Frequency

CL = 25 pF

135

135

135

MHz

Minimum Pulse Width

1.50

1.50

1.50

ns

Reset Recovery Time

1.25

1.25

1.25

ns

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

3. Within−Device Skew defined as identical transitions on similar paths through a device.

Symbol

Characteristic

Condition

Min

Nom

Max

Unit

mum pulse width

(HIGH or LOW)

CL

Q0 − Q3

Q0 − Q1

4.75

10

5.0

5.25

50

V

pF

mum pulse width

(HIGH or LOW)

CL

Q0 − Q3

4.875

15

5.0

5.125

27

V

pF