MCR8DSM, MCR8DSN

http://onsemi.com

6

PACKAGE DIMENSIONS

DPAK

CASE 369C

ISSUE O

D

A

K

B

R

V

S

F

L

G

2 PL

M

0.13 (0.005)

T

E

C

U

J

H

PLANE

Z

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.235

0.245

5.97

6.22

B

0.250

0.265

6.35

6.73

C

0.086

0.094

2.19

2.38

D

0.027

0.035

0.69

0.88

E

0.018

0.023

0.46

0.58

F

0.037

0.045

0.94

1.14

G

0.180 BSC

4.58 BSC

H

0.034

0.040

0.87

1.01

J

0.018

0.023

0.46

0.58

K

0.102

0.114

2.60

2.89

L

0.090 BSC

2.29 BSC

R

0.180

0.215

4.57

5.45

S

0.025

0.040

0.63

1.01

U

0.020

−−−

0.51

−−−

V

0.035

0.050

0.89

1.27

Z

0.155

−−−

3.93

−−−

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

12

3

4

5.80

0.228

2.58

0.101

1.6

0.063

6.20

0.244

3.0

0.118

6.172

0.243

mm

inches

SCALE 3:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

STYLE 4:

PIN 1. CATHODE

2. ANODE

3. GATE

4. ANODE

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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MCR8DSM/D

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