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MC10EL89DTR2G Datasheet(PDF) 2 Page - ON Semiconductor |
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MC10EL89DTR2G Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 8 page MC10EL89 http://onsemi.com 2 Table 1. PIN DESCRIPTION PIN Function D, D ECL Data Inputs Q0, Q0; Q1, Q1 ECL Data Outputs (1.6 Vpp) VCC Positive Supply VEE Negative Supply EP Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 50 KW Internal Input Pullup Resistor N/A ESD Protection Human Body Model Machine Model > 2 kV > 100 V Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 31 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 8 V VEE NECL Mode Power Supply VCC = 0 V −8 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V VI VCC VI VEE 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SO−8 SO−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SO−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 ± 5% °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder Pb Pb−Free <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C 265 265 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. |
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