MBRS3201T3

http://onsemi.com

4

PACKAGE DIMENSIONS

SMC

CASE 403−03

ISSUE E

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

1.90

2.13

2.41

0.075

INCHES

A1

0.05

0.10

0.15

0.002

b

2.92

3.00

3.07

0.115

c

0.15

0.23

0.30

0.006

D

5.59

5.84

6.10

0.220

E

6.60

6.86

7.11

0.260

L

0.76

1.02

1.27

0.030

0.084

0.095

0.004

0.006

0.118

0.121

0.009

0.012

0.230

0.240

0.270

0.280

0.040

0.050

NOM

MAX

7.75

7.94

8.13

0.305

0.313

0.320

4.343

0.171

3.810

0.150

2.794

0.110

mm

inches

SCALE 4:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

E

bD

c

L1

L

A1

A

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.

4. 403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03.

0.020 REF

0.51 REF

L1

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