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TPA3004D2 SLOS407D − FEBRUARY 2003 − REVISED AUGUST 2004 www.ti.com 5 Terminal Functions (Continued) TERMINAL I/O DESCRIPTION NO. NAME I/O DESCRIPTION VAROUTR 32 O Variable output for right channel audio. Line level output for driving external HP amplifier. VCLAMPL 25 − Internally generated voltage supply for left channel bootstrap capacitors. VCLAMPR 36 − Internally generated voltage supply for right channel bootstrap capacitors. VOLUME 11 I DC voltage that sets the gain of the Class-D and VAROUT outputs. VREF 8 I Analog reference for gain control section. V2P5 4 O 2.5-V Reference for analog cells, as well as reference for unused audio input when using single-ended inputs. — Thermal Pad − Connect to AGND and PGND—should be center point for both grounds. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) UNIT Supply voltage range: AVCC, PVCC −0.3 V to 20 V Load impedance, RL ≥ 3.6 Ω MODE, VREF, VARDIFF, VARMAX, VOLUME, FADE 0 V to 5.5 V Input voltage range, VI SD −0.3 V to VCC + 0.3 V Input voltage range, VI RINN, RINP, LINN, LINP −0.3 V to 7 V Supply current AVDD 120 mA Supply current AVDDREF 10 mA Output current VAROUTL, VAROUTR 20 mA Continuous total power dissipation See Dissipation Rating Table Operating free-air temperature range, TA −40 °C to 85°C Operating junction temperature range, TJ(2) −40 °C to 150°C Storage temperature range, Tstg −65 °C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The TPA3004D2 incorporates an exposed PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature that could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package. PACKAGE DISSIPATION RATINGS PACKAGE TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C PHP 4.3 W 34.7 mW/ °C(1) 2.7 W 2.2 W (1) The PowerPAD must be soldered to a thermal land on the printed circuit board. Please refer to the PowerPAD Thermally Enhanced Package application note (SLMA002 |
