2SA1774

http://onsemi.com

4

PACKAGE DIMENSIONS

STYLE 1:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

SC−75/SOT−416

CASE 463−01

ISSUE F

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

M

0.20 (0.008)

D

−E−

−D−

b

e

3 PL

0.20 (0.008) E

C

L

A

A1

3

2

1

DIM

MIN

NOM

MAX

MILLIMETERS

A

0.70

0.80

0.90

A1

0.00

0.05

0.10

b

C

0.10

0.15

0.25

D

1.55

1.60

1.65

E

e

1.00 BSC

0.027

0.031

0.035

0.000

0.002

0.004

0.004

0.006

0.010

0.059

0.063

0.067

0.04 BSC

MIN

NOM

MAX

INCHES

0.15

0.20

0.30

0.006

0.008

0.012

L

0.10

0.15

0.20

1.50

1.60

1.70

0.004

0.006

0.008

0.061

0.063

0.065

0.70

0.80

0.90

0.027

0.031

0.035

0.787

0.031

0.508

0.020

1.000

0.039

mm

inches

SCALE 10:1

0.356

0.014

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

1.803

0.071

ON Semiconductor and

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liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental

damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over

time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under

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