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FAN5099EMX Datasheet(PDF) 4 Page - Fairchild Semiconductor

Part # FAN5099EMX
Description  Wide Frequency Synchronous Buck PWM AND LDO Controller
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Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN5099EMX Datasheet(HTML) 4 Page - Fairchild Semiconductor

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© 2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN5099 Rev. 1.1.3
4
Absolute Maximum Ratings
The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The
device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables
are not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table defines the
conditions for actual device operation.(1)
Notes:
1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only; functional operation of the device at these or any conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless
otherwise specified, all other voltages are referenced to AGND.
2. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
Thermal Information
3. Junction-to-ambient thermal resistance,
θJA, is a strong function of PCB material, board thickness, thickness and
number of copper planes, number of vias used, diameter of vias used, available copper surface, and attached heat
sink characteristics.
Recommended Operating Conditions
Parameter
Min.
Max.
Unit
VCC to PGND
6.0
V
BOOT to PGND
33.0
V
SW to PGND
Continuous
-0.5
33.0
V
Transient (t < 50ns, f < 500kHz)
-3.0
33.0
V
HDRV (VBOOT – VSW)
6.0
V
LDRV
-0.5
6.0
V
All Other Pins
-0.3
VCC + 0.3
V
Maximum Shunt Current for VCC
150
mA
Electrostatic Discharge (ESD) Protection
Level(2)
HBM
3.5
kV
CDM
1.8
Symbols
Parameter
Min.
Typ.
Max.
Unit
TSTG
Storage Temperature
-65
150
°C
TL
Lead Soldering Temperature, 10 Seconds
300
°C
Vapor Phase, 60 Seconds
215
°C
Infrared, 15 Seconds
220
°C
PD
Power Dissipation, TA = 25°C
715
mW
θJC
Thermal Resistance – Junction-to-Case
37
°C/W
θJA
Thermal Resistance – Junction-to-Ambient(3)
100
°C/W
Symbols
Parameter
Conditions
Min.
Typ.
Max.
Unit
VCC
Supply Voltage
VCC to GND
4.5
5.0
5.5
V
TA
Ambient Temperature
Commercial
-10
85
°C
Industrial
-40
85
°C
TJ
Junction Temperature
125
°C


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