2N6027, 2N6028

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2

Rating

Symbol

Value

Unit

Power Dissipation*

Derate Above 25

°C

1/

300

4.0

mW

mW/

°C

DC Forward Anode Current*

Derate Above 25

°C

150

2.67

mA

mA/

°C

DC Gate Current*

"50

mA

Repetitive Peak Forward Current

100

20

1.0

2.0

A

Non−Repetitive Peak Forward Current

10

5.0

A

Gate to Cathode Forward Voltage*

40

V

Gate to Cathode Reverse Voltage*

*5.0

V

Gate to Anode Reverse Voltage*

40

V

Anode to Cathode Voltage* (Note 1)

±40

V

Capacitive Discharge Energy (Note 2)

E

250

mJ

Power Dissipation (Note 3)

300

mW

Operating Temperature

−50 to +100

°C

Junction Temperature

−50 to +125

°C

Storage Temperature Range

−55 to +150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

*Indicates JEDEC Registered Data

2. E = 0.5

3. Derate current and power above 25

°C.

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Thermal Resistance, Junction−to−Case

75

°C/W

Thermal Resistance, Junction−to−Ambient

200

°C/W

Maximum Lead Temperature for Soldering Purposes

(

t1/16″ from case, 10 seconds maximum)

260

°C