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EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS

300 k

Ω

300 k

Ω

7 V

7 V

A Input

B Input

7 V

50

Ω

Input

5

Ω

7 V

Y Output

EQUIVALENT OF EACH A OR B INPUT

EQUIVALENT OF G, G, 1,2EN OR

3,4EN INPUTS

TYPICAL OF ALL OUTPUTS

ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATING TABLE

SN55LVDS32, SN65LVDS32

SN65LVDS3486, SN65LVDS9637

SLLS262N – JULY 1997 – REVISED MARCH 2004

UNIT

–0.5 V to 4 V

Enables and output

Input voltage range

A or B

–0.5 V to 4 V

Continuous total power dissipation

See Dissipation Rating Table

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260°C

Storage temperature range

–65°C to 150°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages, except differential I/O bus voltages, are with respect to the network ground terminal.

PACKAGE

POWER RATING

POWER RATING

POWER RATING

POWER RATING

D (8)

725 mW

5.8 mW/°C

464 mW

377 mW

—

D (16)

950 mW

7.6 mW/°C

608 mW

494 mW

—

DGK

425 mW

3.4 mW/°C

272 mW

221 mW

—

2.14 W

17.1 mW/°C

1.37 W

1.11 W

—

FK

1375 mW

11.0 mW/°C

880 mW

715 mW

275 mW

J

1375 mW

11.0 mW/°C

880 mW

715 mW

275 mW

PW (16)

774 mW

6.2 mW/°C

496 mW

402 mW

—

W

1000 mW

8.0 mW/°C

640 mW

520 mW

200 mW

(1)

This is the inverse of the junction-to-ambient thermal resistance when board mounted and with no air flow.

(2)

The PowerPAD™ must be soldered to a thermal land on the printed-circuit board. See the application note PowerPAD Thermally

Enhanced Package (SLMA002)

4

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