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EP1C12Q100I8ES Datasheet(PDF) 5 Page - Altera Corporation

Part # EP1C12Q100I8ES
Description  Cyclone FPGA Family Data Sheet
Download  104 Pages
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Manufacturer  ALTERA [Altera Corporation]
Direct Link  http://www.altera.com
Logo ALTERA - Altera Corporation

EP1C12Q100I8ES Datasheet(HTML) 5 Page - Altera Corporation

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Altera Corporation
1–3
January 2007
Preliminary
Features
Cyclone devices are available in quad flat pack (QFP) and space-saving
FineLine® BGA packages (see Table 1–2 through 1–3).
Vertical migration means you can migrate a design from one device to
another that has the same dedicated pins, JTAG pins, and power pins, and
are subsets or supersets for a given package across device densities. The
largest density in any package has the highest number of power pins; you
must use the layout for the largest planned density in a package to
provide the necessary power pins for migration.
For I/O pin migration across densities, cross-reference the available I/O
pins using the device pin-outs for all planned densities of a given package
type to identify which I/O pins can be migrated. The Quartus® II
software can automatically cross-reference and place all pins for you
when given a device migration list. If one device has power or ground
pins, but these same pins are user I/O on a different device that is in the
migration path,the Quartus II software ensures the pins are not used as
user I/O in the Quartus II software. Ensure that these pins are connected
to the appropriate plane on the board. The Quartus II software reserves
I/O pins as power pins as necessary for layout with the larger densities
in the same package having more power pins.
Table 1–2. Cyclone Package Options & I/O Pin Counts
Device
100-Pin TQFP
(1)
144-Pin TQFP
(1), (2)
240-Pin PQFP
(1)
256-Pin
FineLine BGA
324-Pin
FineLine BGA
400-Pin
FineLine BGA
EP1C3
65
104
EP1C4
249
301
EP1C6
98
185
185
EP1C12
173
185
249
EP1C20
233
301
Notes to Table 1–2:
(1)
TQFP: thin quad flat pack.
PQFP: plastic quad flat pack.
(2)
Cyclone devices support vertical migration within the same package (i.e., designers can migrate between the
EP1C3 device in the 144-pin TQFP package and the EP1C6 device in the same package)


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