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594D22X0-016C2T Datasheet(PDF) 7 Page - Vishay Siliconix |
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594D22X0-016C2T Datasheet(HTML) 7 Page - Vishay Siliconix |
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7 / 9 page  www.vishay.com 72 594D Vishay Sprague Document Number 40006 Revision 09-Mar-05 For technical questions, contact tantalum@vishay.com 3.2 The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10% of the DC working voltage at + 25°C. 4.0 Reverse Voltage: These capacitors are capable of withstanding peak voltages in the reverse direction equal to 10% of the DC rating at + 25°C and 5% of the DC rating at + 85°C. 5.0 Temperature Derating: If these capacitors are to be operated at temperatures above + 25°C, the permissible rms ripple current or voltage shall be calculated using the derating factors as shown: Derating Factor 1.0 0.9 0.4 Temperature + 25°C + 85°C + 125°C 6.0 Power Dissipation: Power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent Irms value be established when calculating permissible operating levels. (Power dissipation calculated using + 25°C temperature rise.) B C D R Maximum Permissible Power Dissipation @ + 25 °C (Watts) in free air Case Code 0.085 0.110 0.150 0.250 7.0 Printed Circuit Board Material: The capacitors are compatible with most commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). If your desired board material is not shown there, please contact the Tantalum Marketing Department for assistance in determining compatibility. 8. Attachment: 8.1 Solder Paste: The recommended thickness of the solder paste after applications is .007" ± .001" [1.78mm ± .025mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. 8.2 Soldering: Capacitors can be attached by conventional soldering techniques, vapor phase, convection, infrared reflow wave soldering and hot GUIDE TO APPLICATION (Continued) plate methods. The Soldering Profile charts show typical recomended time/temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2°C per second. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor. RECOMMENDED REFLOW SOLDERING PROFILE Recommended SnPb Reflow Soldering Profile TIME (seconds) All Case Codes 60 - 90 sec Preheat 100 °C 150 °C 225 °C 183 °C 10 sec 60 sec 25 °C Recommended Pb Free Reflow Soldering Profile TIME (seconds) Large Case Codes: D, R 60 - 150 sec Preheat 150 °C 200 °C 245 °C 217 °C 10 sec 60 sec 25 °C Recommended Pb Free Reflow Soldering Profile TIME (seconds) Large Case Codes: B, C 60 - 150 sec Preheat 150 °C 200 °C 260 °C 217 °C 10 sec 60 sec 25 °C |
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