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MAS9279A1HH06 Datasheet(PDF) 7 Page - Micro Analog systems |
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MAS9279A1HH06 Datasheet(HTML) 7 Page - Micro Analog systems |
7 / 10 page DA9279.003 13 July 2006 7 (10) SOLDERING INFORMATION Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 Maximum Temperature 260°C Maximum Number of Reflow Cycles 3 Reflow profile Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Matte Tin EMBOSSED TAPE SPECIFICATIONS USER FEED DIRECTION 4.0 +/- 0.1 3.23 +/- 0.1 4.0 +/- 0.1 0.254 +/-0.02 ORIENTATION ON TAPE 1.37 +/- 0.1 |
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