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OPA1632 Datasheet(PDF) 9 Page - Texas Instruments |
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OPA1632 Datasheet(HTML) 9 Page - Texas Instruments |
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9 / 15 page  OPA1632 SBOS286A − DECEMBER 2003 − REVISED SEPTEMBER 2006 www.ti.com 9 POWER DISSIPATION AND THERMAL CONSIDERATIONS The OPA1632 does not have thermal shutdown protection. Take care to assure that the maximum junction temperature is not exceeded. Excessive junction temperature can degrade performance or cause permanent damage. For best performance and reliability, assure that the junction temperature does not exceed +125 °C. The thermal characteristics of the device are dictated by the package and the circuit board. Maximum power dissipation for a given package can be calculated using the following formula: P Dmax + Tmax * T A q JA Where: PDmax is the maximum power dissipation in the amplifier (W). Tmax is the absolute maximum junction temperature ( _C). TA is the ambient temperature (_C). qJA = qJC + qCA. qJC is the thermal coefficient from the silicon junctions to the case ( _C/W). qCA is the thermal coefficient from the case to ambient air ( _C/W). For systems where heat dissipation is more critical, the OPA1632 is offered in an MSOP-8 with PowerPAD. The thermal coefficient for the MSOP PowerPAD (DGN) package is substantially improved over the traditional SO package. Maximum power dissipation levels are depicted in Figure 5 for the two packages. The data for the DGN package assumes a board layout that follows the PowerPAD layout guidelines. MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE −40 −15 10 85 60 35 Ambient Temperature ( _C) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 θ JA = 170_ C/W for SO −8 (D) θ JA = 58.4_ C/W for M SOP−8 (DGN ) T J = 150_ C No Airflow SO−8 (D) Package MSOP−8 (DGN) Package Figure 5. Maximum Power Dissipation vs Ambient Temperature (1) |
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