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MAS9270C3SN06 Datasheet(PDF) 2 Page - Micro Analog systems |
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MAS9270C3SN06 Datasheet(HTML) 2 Page - Micro Analog systems |
2 / 9 page DA9270.008 11 September 2006 2 (9) PIN DESCRIPTION Pin Description Symbol x-coordinate y-coordinate Power Supply Voltage VDD 166 1430 Programming Input PV 420 1435 Serial Bus Clock Input CLK 979 1441 Serial Bus Data Input DA 1234 1441 Temperature Output TE1 1488 1441 Test Multiplexer Output TE2 1742 1441 Voltage Control Input VC 185 153 Crystal Oscillator Output X1 439 149 Crystal/Varactor Oscillator Input X2 1357 149 Power Supply Ground VSS 1790 166 Buffer Output OUT 2046 153 Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Min Max Unit Note Supply Voltage VDD - VSS -0.3 6.0 V Input Pin Voltage VSS -0.3 VDD + 0.3 V 1) Power Dissipation PMAX 20 mW Storage Temperature TST -55 150 oC Note 1: Not valid for programming pin PV RECOMMENDED OPERATION CONDITIONS Parameter Symbol Conditions Min Typ Max Unit Note Supply Voltage VDD 2.7 2.8 5.5 V 1) Supply Current ICC Vdd = 2.8 Volt 1.8 mA Operating Temperature TOP -30 +85 oC 2) Storage Temperature TS Relative humidity = 15%…70% -45 +40 oC Crystal Pulling Sensitivity S 30 ppm/pF Crystal Load Capacitance CL 10 pF Note 1: Minimum Supply Voltage 2.6 V for MAS9270Cxx2 version. Note 2: Minimum Operating Temperature –40 °C for MAS9270Cxx3 version. |
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Similar Description - MAS9270C3SN06 |
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