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MAS9187AUA4 Datasheet(PDF) 6 Page - Micro Analog systems |
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MAS9187AUA4 Datasheet(HTML) 6 Page - Micro Analog systems |
6 / 7 page 6 (7) DA9187.002 29 January, 2004 PACKAGE (TSSOP-20) OUTLINES Symbol Min Nom Max Unit A -- -- 1.10 mm A1 0.05 -- 0.15 mm A2 0.85 0.90 0.95 mm b 0.19 -- 0.30 mm b1 0.19 0.22 0.25 mm c 0.09 -- 0.20 mm c1 0.09 -- 0.16 mm D 6.40 6.50 6.60 mm E 6.4 BSC mm E1 4.30 4.40 4.50 mm e 0.65 BSC mm L 0.50 0.60 0.75 mm L1 1.00 REF R 0.09 -- -- mm S -- 0.20 -- mm Dimensions do not include mold or interlead flash, protrusions or gate burrs. Reference Standard : JEDEC MO-153 . SOLDERING INFORMATION Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 2*220 °C Maximum Temperature 240 °C Maximum Number of Reflow Cycles 2 Reflow profile Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15% b b R A A VIEW A-A B B E E1 e A A2 A1 D b c c1 b1 GAUGE PLANE 0.25 VIEW B-B 12° REF 12° REF L L1 S INDEX AREA e/ 2 |
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