Surface Mount

www.littelfuse.com

©2006 Littelfuse

0805L Series

Specifications are subject to change without notice.



Electronics Designers Guide

Environmental Specifications

Operating/Storage

Temperature

-40°Cto+85°C

Maximum Device Surface

Temperature in Tripped State

125°C

Passive Aging

+85°C,1000hours

±5%typicalresistancechange

Humidity Aging

+85°C,85%R.H.1000hours

±5%typicalresistancechange

Thermal Shock

MIL-STD-202Method107G

+85°C/-40°C20times

-30%typicalresistancechange

Solvent Resistance

MIL-STD-202,Method215

Nochange

Vibration

MIL-STD-883C,Method2007.1,

ConditionA

Nochange

Physical Specifications

Terminal Material

Gold-PlatedCopperorSolder-Plated

Copper(SolderMaterial:MatteTin(Sn))

Lead Solderability

MeetsEIASpecificationRS186-9E,ANSI/

J-STD-002Category3.

Soldering Parameters

Condition

Reflow

Peak Temp/ Duration Time

260°C/10Sec

Time above liquids (TAL) 220°C

60Sec~100Sec

Preheat 120°C~ 180°C

50Sec~150Sec

Storage Condition

0°C~35°C,<

=70%RH

•Recommendedreflowmethods:IR,vaporphaseoven,hotair

oven,N

•Devicesarenotdesignedtobewavesolderedtothebottomside

oftheboard.

•Recommendedmaximumpastethicknessis0.25mm(0.010inch)

•Devicescanbecleanedusingstandardindustrymethodsand

solvents.

Note:Ifreflowtemperaturesexceedtherecommendedprofile,

devicesmaynotmeettheperformancerequirements.

Preheating

120

180

220

260

0

60 to 100

Soldering

Cooling

120

50 to 150

Time(s)