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SN65HVD3086EDGS Datasheet(PDF) 2 Page - Texas Instruments |
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SN65HVD3086EDGS Datasheet(HTML) 2 Page - Texas Instruments |
2 / 15 page www.ti.com ABSOLUTE MAXIMUM RATINGS SN65HVD3080E SN65HVD3083E SN65HVD3086E SLLS771A – NOVEMBER 2006 – REVISED DECEMBER 2006 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION PART NUMBER PACKAGE(1) MARKED AS SN65HVD3080E BTT SN65HVD3083E DGS, DGSR (2) BTU SN65HVD3086E BTF (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. (2) The R suffix indicated tape and reel. over operating free-air temperature range unless otherwise noted(1) UNIT VCC Supply voltage range(2) –0.3 V to 7 V V(A), V(B), V(Y), V(Z) Voltage range at any bus terminal (A, B, Y, Z) –9 V to 14 V Voltage input, transient pulse through 100 Ω. V(TRANS) –50 to 50 V See Figure 10 (A, B, Y, Z) VI Input voltage range (D, DE, RE) -0.3 V to VCC+0.3 V PD Continuous total power dissipation See the dissipation rating table TJ Junction temperature 170 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. POWER DISSIPATION RATINGS DERATING FACTOR(1) PACKAGE TA < 25°C TA = 85°C ABOVE TA < 25°C DGS-10 463 mW 3.71 mW/ °C 241 mW (1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. ELECTROSTATIC DISCHARGE PROTECTION PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Human Body Model(1) A,B,Y,Z, and GND 16k V All pins 6k V Field-induced-Charged Device Mode(2) All pins 1.5k V Machine Model 200 V (1) Tested in accordance JEDEC Standard 22, Test Method A114-A. Bus pin stressed with respect to a common connection of GND and VCC. (2) Tested in accordance JEDEC Standard 22, Test Method C101. 2 Submit Documentation Feedback |
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