DRV401

SBVS070A − JUNE 2006 − REVISED OCTOBER 2006

www.ti.com

4

ELECTRICAL CHARACTERISTICS (continued)

DRV401

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

VOLTAGE REFERENCE

No Load

2.495

2.5

2.505

V

No Load

±5

±50

ppm/

°C

±15

±200

µV/V

0.15

mV/mA

Short-Circuit Current

+20

mA

−18

mA

DEMAGNETIZATION

Duration

See Timing Diagram

106

ms

DIGITAL I/O

LOGIC INPUTS (DEMAG, GAIN, and CCdiag Pins)

CMOS Type Levels

Pull-Up High Current (CCdiag)

160

µA

Pull-Up Low Current (CCdiag)

5

µA

Logic Input Leakage Current

0.01

5

µA

Logic Level, Input: L/H

2.1/2.8

V

Hysteresis

0.7

V

OUTPUTS (ERROR AND OVER-RANGE Pins)

Logic Level, Output: L

4mA Sink

0.3

V

Logic Level, Output: H

No Internal Pull-Up

OUTPUTS (PWM and PWM Pins)

Push-Pull Type

Logic Level L

4mA Sink

0.2

V

Logic Level H

4mA Source

V

POWER SUPPLY

Specified Voltage Range

VDD

4.5

5

5.5

V

Power-On Reset Threshold

1.8

V

6.8

mA

4

V

Brownout Indication Delay

135

µs

TEMPERATURE RANGE

Specified Range

−40

+125

°C

Operating Range

−50

+150

°C

Package Thermal Resistance

QFN Surface-Mount

See Note 6

40

°C/W

SO PowerPAD Surface-Mount

See Note 6

27

°C/W

(1) Parameter value referred to output (RTO).

(2) See Typical Characteristic curves.

(3) Total input resistance and comparator threshold current are inversely related. See Figure 2a.

(4) For VAC sensors, 0.2% of PWM offset approximately corresponds to 10mA primary current offset per winding.

(5) See Compensation Driver section in Applications Information.

(6) See Applications Information section for information on power dissipation, layout considerations, and proper PCB soldering and heat-sinking technique.