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K4C89363AF-TCFB Datasheet(PDF) 7 Page - Samsung semiconductor

Part # K4C89363AF-TCFB
Description  2,097,152-WORDS x 4 BANKS x 36-BITS DOUBLE DATA RATE Network-DRAM
Download  58 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K4C89363AF-TCFB Datasheet(HTML) 7 Page - Samsung semiconductor

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K4C89363AF
REV. 0.0 Nov. 2002
- 7 -
1. All voltages are referenced to Vss, VssQ.
2. V
REF
is expected to track variations in VddQ DC level of the transmitting device.
Peak to peak AC noise on V
REF may not exceed ± 2% of
V
REF (DC).
3. Overshoot Iimit : V
IH (max.) = VddQ + 0.7V with a pulse width <= 5ns
4. Undershoot Iimit : V
IL(min.) = -0.7V with a pulse width <= 5ns
5. V IH (DC) and V IL (DC) are levels to maintain the current logic state.
6. V
IH (AC) and V IL(AC) are levels to change to the new logic state.
7. V
ID is magnitude of the difference between CLK input level and CLK input level.
8. The value of Vx(AC) is expected to equal VddQ/2 of the transmitting device.
9. V
ISO means [V ICK(CLK) + V ICK(CLK )]/2
10. Refer to the figure below.
Notes
:
11. In the case of external termination, VTT(Termination Voltage) should be gone in the range of V REF(DC) ±0.04V.
Pin Capacitance (V
DD = 2.5V, V DDQ = 1.8V, f = 1 MHz, Ta = 25
o
C )
Note : These parameters are periodically sampled and not 100% tested.
Symbol
Parameter
Min
Max
Delts
Units
C
IN
Input Pin Capacitance
1.5
2.5
0.25
pF
C INC
Clock Pin (CLK, CLK ) Capacitance
1.5
2.5
0.25
pF
C I/O
DQ, DS, QS Capacitance
2.5
3.5
0.5
pF
C
NC
NC Pin Capacitance
-
1.5
-
pF
CLK
CLK
V
SS
V
ID (AC)
0 V Differential
V ISO
V
SS
V
ICK
V
ISO (min)
V
X
V
X
V
X
V
X
V
ICK
V
ICK
V
ICK
V
ISO(max)
V
X
V
ID (AC)


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