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SN74SSTV16859RGQ8 Datasheet(PDF) 8 Page - Texas Instruments |
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SN74SSTV16859RGQ8 Datasheet(HTML) 8 Page - Texas Instruments |
8 / 10 page MECHANICAL DATA MPQF113C − DECEMBER 2001 − REVISED AUGUST 2002 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 RGQ (S−PQFP−N56) PLASTIC QUAD FLATPACK 4203438/D 08/2002 Bottom View 56X 0,23 7,85 8,15 D 43 42 56 1 0,08 C 1 7,65 7,85 56 0,50 A +0,07 −0,05 0,05 0,10 M C M CB 29 28 14 15 0,30 Seating Plane 0,00 0,05 C 7,85 8,15 A B 5,35 5,05 4,35 4,65 43 42 29 28 15 14 0,80 1,00 Pin 1 Identifier Exposed Thermal Die Pad Pin 1 Identifier 4X 0,50 6,50 56X Sq 0,20 Nominal Lead Frame NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. QFN (Quad Flatpack No-Lead) Package configuration. D. The Package thermal performance may be enhanced by bonding the thermal die pad to an external thermal plane. This pad may be electrically connected to ground. E. Package registration with JEDEC MO-220 variation VLLD-2. |
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