LTC3200/LTC3200-5

10

PACKAGE DESCRIPTIO

MS8 Package

8-Lead Plastic MSOP

(LTC DWG # 05-08-1660)

OPERATIO

The power dissipated in the LTC3200/LTC3200-5 should

always fall under the line shown for a given ambient

temperature. The power dissipated in the LTC3200/

LTC3200-5 is given by the expression:

This derating curve assumes a maximum thermal

resistance,

LTC3200-5 and the 8 pin MSOP adjustable LTC3200

which can be achieved from a printed circuit board layout

with a solid ground plane and a good connection to the

ground pins of the LTC3200/LTC3200-5. Operation out-

side of this curve will cause the junction temperature to

exceed 160

°C which may trigger the thermal shutdown

circuitry.

MSOP (MS8) 1100

* DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH,

PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

0.021

± 0.006

(0.53

± 0.015)

0

° – 6° TYP

SEATING

PLANE

0.007

(0.18)

0.043

(1.10)

MAX

0.009 – 0.015

(0.22 – 0.38)

0.005

± 0.002

(0.13

± 0.05)

0.034

(0.86)

REF

0.0256

(0.65)

BSC

12

3

4

0.193

± 0.006

(4.90

± 0.15)

8

7 6

5

0.118

± 0.004*

(3.00

± 0.102)

0.118

± 0.004**

(3.00

± 0.102)