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HIN213IB Datasheet(PDF) 9 Page - Harris Corporation |
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HIN213IB Datasheet(HTML) 9 Page - Harris Corporation |
9 / 14 page 8-11 Absolute Maximum Ratings Thermal Information VCC to Ground . . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <VCC < 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (VCC -0.3V) <V+ < 12V V- to Ground . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V) Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VIN < (V+ +0.3V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VTXOUT < (V+ +0.3V) ROUT. . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ROUT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 Operating Conditions Temperature Range HIN-XXXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to 70oC HIN-XXXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC Thermal Resistance (Typical, Note 1) θ JA ( oC/W) 16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . . 115 16 Ld SOIC (W) Package . . . . . . . . . . . . . . . . . . . . 100 16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 155 16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90 20 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 100 24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 135 24 Ld PDIP (N) Package . . . . . . . . . . . . . . . . . . . . . 75 24 Ld PDIP (W) Package. . . . . . . . . . . . . . . . . . . . . 60 28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70 28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . . .-40oC to 85oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC and SSOP - Lead Tips Only) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5% HIN200, HIN203, HIN205, HIN207); V+ = 9V to 13.2V, HIN201 and HIN209), C1-C4 = 0.1 µF; TA = Operating Temperature Range PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Output Voltage Swing, TOUT Transmitter Outputs, 3k Ω to Ground ±5 ±9 ±10 V Power Supply Current, ICC No Load, TA = 25 oC HIN202, HIN203 - 8 15 mA HIN200, HIN204-208, HIN211-213 -11 20 mA HIN201, HIN209 - 0.4 1 mA V+ Power Supply Current, ICC No Load, TA = 25 oC HIN201 - 5.0 10 mA HIN209 - 7.0 15 mA Shutdown Supply Current, ICC(SD) TA = 25 oC HIN200, HIN205, HIN206, HIN211 -1 10 µA HIN213 - 15 50 µA Input Logic Low, TIN, EN, VlL TIN, EN, SD, EN, SD - - 0.8 V Input Logic High, VlH TIN 2.0 - - V EN, SD, EN, SD 2.4 - - V Logic Pullup Current, IP TIN = 0V - 15 200 µA RS-232 Input Voltage Range, VIN -30 - +30 V Receiver Input Impedance, RIN TA = 25 oC, V IN = ±3V 3.0 5.0 7.0 k Ω Receiver Input Low Threshold, VIN (H-L) VCC = 5V, TA = 25 oC Active Mode 0.8 1.2 - V Shutdown Mode HIN213 R4 and R5 0.6 1.5 - V HIN200 thru HIN213 |
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