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www.ti.com VREF RAC (1) Pull-uprailcouldbeeitherVREForothersystemrail. (2) SRSET/ACSET couldcomefromeitherDACorresistordividers. Q2 (ACFET) SI4435 Q3(BATFET) SI4435 P P ACN ACP ACDRV ACDET ACGOOD SRSET ACSET VREF CELLS CHGEN VDAC VADJ GPIO ADC IADAPT HOST PVCC BATDRV HIDRV PH BTST REGN LODRV PGND SRP SRN P PACK+ PACK- SYSTEM ADAPTER+ ADAPTER- ACGOOD AGND bq24750 432kW 1% 1% R1 R2 R5 10kW C4 1 F m C5 100pF Q4 FDS6680A Q5 FDS6680A L1 8.2 H m D1 BAT54 BAT VREF TS PACK THERMISTER SENSE 1 % R3 118kW R4 DPMDET R6 10kW ACOP Q1 (ACFET) SI4435 C6 10 F m C3 0.010 W C2 0.1 F m 0.1 F m 66.5kW 5.6kW C7 10 F m C8 1 F m C9 0.1 F m C10 1 F m C15 0.1 F m C16 0.47 F m C14 0.1 F m C13 0.1 F m C11 10 F m R 0.010 SR W C12 10 F m C19 10 F m C1 10 F m C18 10 F m 66.5kW R10 R9 100kW 43kW R8 R7 100kW C17 10 F m PowerPad R11100kW PACKAGE THERMAL DATA SLUS735 – DECEMBER 2006 A. VIN=20 V, VBAT = 3-cell Li-Ion, ICHARGE = 3 A, IADAPTER_LIMIT = 4 A, TBAT = 0-45°C Figure 2. Typical System Schematic, Voltage and Current Programmed by Resistor ORDERING INFORMATION Part number Package Ordering Number Quantity (Tape and Reel) bq24750RHDR 3000 bq24750 28-PIN 5 x 5 mm QFN bq24750RHDT 250 PACKAGE θ JA TA = 70°C POWER RATING DERATING FACTOR ABOVE TA = 25°C QFN – RHD(1)(2) 39 °C/W 2.36 W 0.028 W/ °C (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI (2) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is connected to the ground plane by a 2x3 via matrix. 3 |
