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MPC106ARX83DG Datasheet(PDF) 5 Page - Motorola, Inc |
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MPC106ARX83DG Datasheet(HTML) 5 Page - Motorola, Inc |
5 / 28 page MPC106 PCI Bridge/Memory Controller Hardware Specifications 5 General Parameters 1.3 General Parameters The following list provides a summary of the general parameters of the 106: Technology 0.5 µm CMOS, four-layer metal Die size 5.8 mm x 7.2 mm (41.8 mm2) Transistor count 250,000 Logic design Fully-static Packages Surface mount 304-lead C4 ceramic ball grid array (CBGA) Power supply 3.3 V ± 5% V DC Maximum input rating 5.0 V ± 10% V DC 1.4 Electrical and Thermal Characteristics This section provides both the AC and DC electrical specifications and thermal characteristics for the 106. 1.4.1 DC Electrical Characteristics The tables in this section describe the 106 DC electrical characteristics. Table 1 provides the absolute maximum ratings. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause it permanent damage. Table 2 provides the recommended operating conditions for the 106. Proper device operation outside of these recommended and tested conditions is not guaranteed. Table 1. Absolute Maximum Ratings Characteristic Symbol Value Unit Notes Supply voltage Vdd –0.3 to 3.6 V — PLL supply voltage AVdd –0.3 to 3.6 V — Input voltage Vin –0.3 to 5.5 V 1 Junction temperature Tj 0 to 105 °C 2 Storage temperature range Tstg –55 to 150 °C — Notes: 1 Caution: Vin must not exceed Vdd by more than 2.5 V at all times including during power-on reset. 2 The extended temperature parts have die junction temperature of -40 to 105°C. See MPC106ARXTGPNS/D for more information. |
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