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LT1977EFE Datasheet(PDF) 7 Page - Linear Technology |
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LT1977EFE Datasheet(HTML) 7 Page - Linear Technology |
7 / 24 page LT1977 7 1977f PI FU CTIO S voltage on the PGFB pin drops below VPGFB, CCT will be discharged rapidly to 0V and PG will be active low with a 200µA sink capability. If the CT pin is clamped (Power Good condition) during normal operation and SHDN is taken low, the CT pin will be discharged and a delay period will occur when SHDN is returned high. See the Power Good section in Applications Information for details. GND (Pins 8, 17): The GND pin connection acts as the reference for the regulated output, so load regulation will suffer if the “ground” end of the load is not at the same voltage as the GND pin of the IC. This condition will occur when load current or other currents flow through metal paths between the GND pin and the load ground. Keep the path between the GND pin and the load ground short and use a ground plane when possible. The GND pin also acts as a heat sink and should be soldered (along with the exposed leadframe) to the copper ground plane to reduce thermal resistance (see Applications Information). CSS (Pin 9): A capacitor from the CSS pin to the regulated output voltage determines the output voltage ramp rate during start-up. When the current through the CSS capaci- tor exceeds the CSS threshold (ICSS), the voltage ramp of the output is limited. The CSS threshold is proportional to the FB voltage (see Typical Performance Characteristics) and is defeated for FB voltage greater than 0.9V (typical). See Soft-Start section in Applications Information for details. BIAS (Pin 10): The BIAS pin is used to improve efficiency when operating at higher input voltages and light load current. Connecting this pin to the regulated output volt- age forces most of the internal circuitry to draw its operating current from the output voltage rather than the input supply. This architecture increases efficiency espe- cially when the input voltage is much higher than the output. Minimum output voltage setting for this mode of operation is 3V. VC (Pin 11): The VC pin is the output of the error amplifier and the input of the peak switch current comparator. It is normally used for frequency compensation, but can also serve as a current clamp or control loop override. VC sits at about 0.45V for light loads and 2.2V at maximum load. During the sleep portion of Burst Mode operation, the VC pin is held at a voltage slightly below the burst threshold for better transient response. Driving the VC pin to ground will disable switching and place the IC into sleep mode. FB (Pin 12): The feedback pin is used to determine the output voltage using an external voltage divider from the output that generates 1.25V at the FB pin . When the FB pin drops below 0.9V, switching frequency is reduced, the SYNC function is disabled and output ramp rate control is enabled via the CSS pin. See the Feedback section in Applications Information for details. PGFB (PIN 13): The PGFB pin is the positive input to a comparator whose negative input is set at VPGFB. When PGFB is taken above VPGFB, current (ICSS) is sourced into the CT pin starting the PG delay period. When the voltage on the PGFB pin drops below VPGFB, the CT pin is rapidly discharged resetting the PG delay period. The PGFB volt- age is typically generated by a resistive divider from the regulated output or input supply. See Power Good section in Applications Information for details. SYNC (Pin 14): The SYNC pin is used to synchronize the internal oscillator to an external signal. It is directly logic compatible and can be driven with any signal between 30% and 70% duty cycle. The synchronizing range is equal to maximum initial operating frequency up to 700kHz. When the voltage on the FB pin is below 0.9V the SYNC function is disabled. See the Synchronizing section in Applications Information for details. SHDN (Pin 15): The SHDN pin is used to turn off the regulator and to reduce input current to less than 1µA. The SHDN pin requires a voltage above 1.2V with a typical source current of 3µA to take the IC out of the shutdown state. PG (Pin 16): The PG pin is functional only when the SHDN pin is above its threshold, and is active low when the internal clamp on the CT pin is below its clamp level and high impedance when the clamp is active. The PG pin has a typical sink capability of 200µA. See the Power Good section in Applications Information for details. |
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