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JM1AN-TMP-DC24V Datasheet(PDF) 1 Page - Nais(Matsushita Electric Works) |
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JM1AN-TMP-DC24V Datasheet(HTML) 1 Page - Nais(Matsushita Electric Works) |
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1 / 4 page  114 JM-RELAYS VDE COMPACT POWER RELAY FOR INDUCTIVE LOAD Slim TMP type 16 .630 26.5 1.043 30.4 1.197 Flat TMP type 28.5 1.122 31 1.220 17.2 .677 Flat TM type mm inch 28.5 1.122 31 1.220 16.8 .661 FEATURES • Compact, high-capacity, and resis- tant to inductive loads The relay is a compact 16 ×30.4×26.5 mm .630 ×1.197×1.043 inch. It can control an inductive load (cos ϕ = 0.7) with inrush current of 70 A and steady state current of 20 A. • Excellent contact welding resistance High contact pressure, a forced opening mechanism, and a forced wiping mechanism realizes an excellent contact welding resistance. • High breakdown voltage and surge resistant relay More than 6.4 mm .252 inch maintained for the insulation distance between con- tacts and coil, and the breakdown voltage between contacts and coil is 5,000 V for 1 minute. In addition, the surge resistance between contacts and coil is greater than 10,000 V. • Resistant to external force An absorber mechanism is used on the load terminals, giving a large improve- ment in characteristics variations caused by the external force during FASTON placement/removal. • Flux resistance mechanism The terminal area is plugged with resin to prevent flux seepage during PCB mount- ing. (TMP type) • Conforms to the various safety stan- dards UL, CSA approved. TÜV, VDE under application. • The line up can support economical mounting methods. The relay are equipped with a drive termi- nal (coil terminal) on one side for PCBs, and a load terminal (tab terminal #250) on the reverse side. The line up includes the TM type which can be attached directly to the PCB composing a drive circuit, and the TMP type which supports economical wiring. The TMP type can also be directly attached, and a high capacity load can be wired to the tab terminal. SPECIFICATIONS Contact Coil Characteristics Arrangement 1 Form A Initial contact resistance, max. (By voltage drop 6 V DC 1 A) 30 m Ω (Cd free type: 100 m Ω) Contact material Silver alloy Rating (resistive load) Nominal switching capacity 20 A 250 V AC Max. switching power 5,000 VA Max. switching voltage 250 V AC Max. switching current 20 A Expected life (min. ope.) Mechanical (at 180 cpm) 106 Electrical Life (at 20 cpm) Resistive load 20 A, 250 V AC (cos ϕ = 1) 105 Inductive load Inrush 70 A, Steady 20 A (250 V AC cos ϕ = 0.7) 105 Inrush 80 A, Cut-off 80 A (When the motor is locked) (250 V AC cos ϕ = 0.7) 1.5 ×103 Nominal operating power 900 mW Max. operating speed 180 cpm Initial insulation resistance*1 Min. 100 M Ω (at 500 V DC) Initial breakdown voltage*2 Between open contacts 1,000 Vrms for 1 min. Between con- tacts and coil 5,000 Vrms for 1 min. Surge voltage between con- tact and coil*3 Min. 10,000 V Operate time*4 (at nominal voltage)(at 20 °C) Max. 20ms (Approx. 8 ms) Release time (without diode)*4 (at nominal voltage)(at 20 °C) Max. 10ms (Approx. 3 ms) Temperature rise (at 60 °C) Max. 55 °C (Contact switching current: 20 A/voltage applied to coil: 100%V) Shock resistance Functional*5 Min. 98 m/s2 {10 G} Destructive*6 Min. 980 m/s2 {100 G} Vibration resistance Functional*7 10 to 55 Hz at double amplitude of 1.6 mm Destructive 10 to 55 Hz at double amplitude of 2 mm Conditions for operation, transport and storage*8 (Not freezing and condens- ing at low temperature) Ambient temp. –40 °C to +60°C –40 °F to +140°F Humidity 5 to 85% R.H. Unit weight Slim TMP Approx. 28 g .99 oz Flat TMP Approx. 32 g 1.13 oz Flat TM Approx. 33 g 1.16 oz Remarks * Specifications will vary with foreign standards certification ratings. *1 Measurement at same location as "Initial breakdown voltage" section *2 Detection current: 10mA *3 Wave is standard shock voltage of ±1.2 × 50µs according to JEC-212-1981 *4 Excluding contact bounce time *5 Half-wave pulse of sine wave: 11ms; detection time: 10 µs *6 Half-wave pulse of sine wave: 6ms *7 Detection time: 10 µs *8 Refer to 5. Conditions for operation, transport and storage mentioned in AMBIENT ENVIRONMENT (Page 24). |
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