NP Series

http://onsemi.com

5

PACKAGE DIMENSIONS

A

S

D

B

J

P

K

C

H

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN

DIMENSION P.

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.160

0.180

4.06

4.57

B

0.130

0.150

3.30

3.81

C

0.075

0.095

1.90

2.41

D

0.077

0.083

1.96

2.11

H 0.0020 0.0060

0.051

0.152

J

0.006

0.012

0.15

0.30

K

0.030

0.050

0.76

1.27

P

0.020 REF

0.51 REF

S

0.205

0.220

5.21

5.59

SMB

CASE 403C−01

ISSUE A

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

mm

inches

SCALE 8:1

2.743

0.108

2.159

0.085

2.261

0.089

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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NP0640S/D

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