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NCV4274 Datasheet(PDF) 3 Page - ON Semiconductor |
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NCV4274 Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 16 page NCV4274, NCV4274A http://onsemi.com 3 OPERATING RANGE Parameter Symbol Condition Min Max Unit Input Voltage (5.0 V Version) VI 5.5 40 V Input Voltage (3.3 V, and 2.5 V Version) VI 4.5 40 V Junction Temperature TJ −40 150 °C THERMAL RESISTANCE Parameter Symbol Condition Min Max Unit Junction−to−Ambient DPAK Rthja − 70 (Note 6) °C/W Junction−to−Ambient D2PAK Rthja − 60 (Note 6) °C/W Junction−to−Case DPAK Rthjc − 4 °C/W Junction−to−Case D2PAK Rthjc − 3 °C/W Junction−to−Tab SOT−223 Y−JLX, YLX − 14.5 (Note 7) °C/W Junction−to−Ambient SOT−223 RqJA, qJA − 169.7 (Note 7) °C/W 5. Soldered in, 1 cm2 copper area at Pin 4, FR4 6. Soldered in, minimal footprint, FR4 7. 1 oz copper, 5 mm2 copper area, FR4 LEAD SOLDERING TEMPERATURE AND MSL Parameter Symbol Condition Min Max Unit Lead Temperature Soldering, (Note 8) Reflow (SMD styles only), Pb Pb−Free Tsld 60s − 150s Above 183s 30s Max at Peak 60s − 150s Above 217s 40s Max at Peak − − 240 pk 265 pk °C Moisture Sensitivity Level MSL 1 − 8. Per IPC/JEDEC J−STD−020C |
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