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NCP663SQ18T1 Datasheet(PDF) 7 Page - ON Semiconductor |
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NCP663SQ18T1 Datasheet(HTML) 7 Page - ON Semiconductor |
7 / 10 page NCP662, NCV662, NCP663, NCV663 http://onsemi.com 7 APPLICATIONS INFORMATION A typical application circuit for the NCP662/NCV662 and NCP663/NCV663 series are shown in Figure 1 and Figure 2. Input Decoupling (C1) A 1.0 mF capacitor, either ceramic or tantalum is recommended and should be connected close to the device package. Higher capacitance values and lower ESR will improve the overall line transient response. TDK capacitor: C2012X5R1C105K or C1608X5R1A105K Output Decoupling (C2) The NCP662/NCV662 and NCP663/NCV663 are very stable regulators and do not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m W up to 10 W can safely be used. The minimum decoupling value is 0.1 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. TDK capacitor: C2012X5R1C105K, C1608X5R1A105K, or C3216X7R1C105K Enable Operation (NCP662/NCV662 ONLY) The enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. The threshold limits are covered in the electrical specification section of the data sheet. If the enable is not used, the pin should be connected to Vin. Hints Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. Thermal As power across the NCP662/NCV662 and NCP663/NCV663 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. The mounting pad configuration on the PCB, the board material, and the ambient temperature effect the rate of temperature rise for the part. This is stating that when the devices have good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: PD + TJ(max) *TA R qJA If junction temperature is not allowed above the maximum 125 °C, then the NCP662/NCV662 and NCP663/NCV663 can dissipate up to 300 mW @ 25 °C. The power dissipated by the NCP662/NCV662 and NCP663/NCV663 can be calculated from the following equation: Ptot + [Vin *Ignd (Iout)] ) [Vin * Vout] *Iout or VinMAX + Ptot ) Vout * Iout Ignd ) Iout If an 100 mA output current is needed then the ground current from the data sheet is 2.5 mA. For the NCP662/NCV662 or NCP663/NCV663 (3.0 V), the maximum input voltage is 6.0 V. |
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