ADT75

Rev. 0 | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

–0.3 V to +7 V

SDA Input Voltage to GND

SDA Output Voltage to GND

SCL Input Voltage to GND

OS/ALERT Output Voltage to GND

Operating Temperature Range

–55°C to +150°C

Storage Temperature Range

–65°C to +160°C

150.7°C

8-Lead MSOP (RM-8)

Power Dissipation1, 2

Thermal Impedance3

205.9°C/W

43.74°C/W

8-Lead SOIC (R-8)

157°C/W

56°C/W

IR Reflow Soldering

Peak Temperature

220°C (0°C/5°C)

Time at Peak Temperature

10 sec to 20 sec

Ramp-Up Rate

3°C/sec maximum

Ramp-Down Rate

–6°C/sec maximum

Time 25°C to Peak Temperature

6 minutes maximum

IR Reflow Soldering (Pb-Free Package)

Peak Temperature

260°C (+0°C)

Time at Peak Temperature

20 sec to 40 sec

Ramp-Up Rate

3°C/sec maximum

Ramp-Down Rate

–6°C/sec maximum

Time 25°C to Peak Temperature

8 minutes maximum

preferential flow direction, for example, components mounted on a heat

sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-

mounted components.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

TEMPERATURE (

°C)

1.2

0.8

1.0

0.6

0.2

0.4

0

MAX PD = 3.4mW AT 150

°C

Figure 3. MSOP Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada-

tion or loss of functionality.